The PESW 2019

Event logoThe PESW is a forum for friendly discussion of emerging ideas aimed at doctoral and prospective doctoral students.

June 27 - 29, the PESW workshop will take place in Roztoky u Prahy (

The Prague Embedded Systems Workshop is a research meeting organized for the 6th time already, which is intended for the presentation of Ph.D. students’ results and partial progress in their research in the field of all aspects of embedded systems design, testing and applications.

The IEEE SB coorganizes the Workshop. IEEE SB also organizes the Student Poster Session.

Download the Call For Papers

Student Poster Session

The objective of the Student Poster Session at the PESW is to provide a forum for presentation of student works defended in this or in the last year (since summer 2019). The presented works must be Bachelor or Master Theses from the field of Embedded Systems.

The poster session is organized by students for students, while the workshop is a unique forum, where you can meet researchers and PhD. students from around the world - you can find new friends, discuss your ideas and have a lot of fun.

Best posters will be rewarded by valuable prizes donated by IEEE and the workshop sponsors.

Please, refer to the PESW webpage to submit your work.

In case of any question, please contact the session Chair:
Jan Belohoubek,

Important Dates

Student posters submission deadline: June 23, 2019
Student posters notification of acceptance: June 25, 2019

Workshop: June 27-29, 2019

Download the Poster Session poster

Posters Accepted for Presentation and Contest Results

All contestants obtained a STM DevBoard, the IEEE gift bag and free access to PESW.

Bachelor Theses
Author Title Institution Best Poster Award
Pavel Chytrý Visualization of telemetry data with holographic glasses FIT ČVUT
Pavel Dohnal Portable sount synthetizer with multitrack recording FIT ČVUT 2ndPrize; ASICentrum and CZ.NIC Award
Jakub Kyzek SmartHome design and implementation FIT ČVUT 1stPrize; CZ.NIC, NXP and STM Award
Master Theses
Author Title Institution Best Poster Award
Jan Říha Implementation and Effectiveness Evaluation of the VeraGreg Scheme on a Low-Cost Microcontroller FIT ČVUT
Paolo Calao Emulation-based Fault Injection of Transient Faults in Complex System-on-Chip Politecnico di Torino
Petr Socha SICAK: SIde-Channel Analysis toolKit FIT ČVUT
Enrico Rovere Automatic Generation of Functional Stress Programs with enhanced observability Politecnico di Torino 1stPrize; IEEE, CZ.NIC, NXP and STM Award
Jan Reznicek Hierarchical Dependability Models based on Non-Homogeneous Continuous Time Markov Chains FIT ČVUT 2ndPrize; ASICentrum, CZ.NIC, NXP and STM Award

Award Partners

IEEE Czechoslovakia Section IEEE Young Professionals

The members of the Institute of Electrical and Electronics Engineers (IEEE) are over 350000 Electrical and Computer Science engineers in ~150 countries worldwide. IEEE is publishing more than 100 periodicals and an important number of books (over 25% of the scientific and technical literature in EE and CS originates from IEEE). It also organizes conferences and fosters the development of the EE and CS field. IEEE is geographically divided in 10 regions, the regions are further divided into sections. Czech Republic and Slovakia are parts of Region 8. Czechoslovakia Section of IEEE was established for Czech and Slovak members of IEEE in 1992.

The award is organized and sponsored by IEEE Young Professionals and IEEE SB at CTU.


CZ.NIC, interest association of legal entities, was founded by leading providers of Internet services in 1998. The association currently has 114 members. The key activities of the association include operation of the domain name registry for the .CZ domain, operation of the CZ top-level domain and public education in the area of domain names. The association is now intensively working on development of the DNSSEC technology and mojeID service, extension and improvements of the domain administration system and support of new technologies and projects beneficial to the Internet infrastructure in the Czech Republic. CZ.NIC is a member of the EURid association, managing the European domain – EU, and other similarly oriented organizations (CENTR, ccNSO etc.).


STMicroelectronics is a world leader in providing the semiconductor solutions that make a positive contribution to people's lives, today and into the future. ST is a global semiconductor company with net revenues of US$ 8.35 billion in 2017. Offering one of the industry's broadest product portfolios, ST serves customers across the spectrum of electronics applications with innovative semiconductor solutions for Smart Driving and the Internet of Things. By getting more from technology to get more from life, ST stands for life.augmented.


ASICentrum, established in 1992 in Prague is a design center of EM Microelectronic and a competence center of ETA, belonging to the Swatch Group. EM Microelectronic is one of the most innovative IC providers. It developed and manufactured the smallest and the lowest power consuming Bluetooth chip on the market, the top performing optical sensors for optical office as well as gaming mice and it was the first to release the award-winning world-first dual-frequency NFC + RAIN RFID em|echo.


We are information security. Our mission is to be a trusted partner to our clients in the field of information and IT security, to understand the client‘s needs and deliver the best technical solutions and services with an individual approach.


CESNET is an association of universities of the Czech Republic and the Czech Academy of Sciences. It operates and develops the national e-infrastructure for science, research and education which encompasses a computer network, computational grids, data storage and collaborative environment. It offers a rich set of services to connected organizations.


NXP Semiconductors N.V. enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security, and privacy and smart connected solutions markets.